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Packaging Engineer Intel jobs

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DETD Packaging TD Engr Intel Phoenix, AZ May 20
DETD Packaging TD Engr - TF Dep - 711387 Description The successful candidate would be expected to develop equipment and process technology for next generation thin film ... She/he will need to interact with equipment and HDI substrate suppliers to enable technologies to meet Intel's long term roadmap and industry-leading vision... more
Planning Execution & Controls Engineer Intel Phoenix, AZ May 20
deliver and support leading edge scheduling and dispatching capabilities for Intel's advanced Assembly Packaging factories. Your responsibilities will include but ... We will accept applications/resumes until 60 days after posting date or earlier at Intel s discretion. Intel invites people of all ages currently enrolled in an... more
Socket Packaging Engineer Intel Phoenix, AZ May 19
Title: Socket Packaging Engineer Location: USA-Arizona, Phoenix Job Number: 712022 ATTD Socket Integration Technology Development (SITD) is seeking engineers to research ... In this position, you will be responsible for technical and schedule integration of socket/connector technology development related to CPU packaging... more
Senior Staff Packaging Engineer Intel Santa Clara, CA May 02
Title: Senior Staff Packaging Engineer Location: USA-California, Santa Clara Job Number: 632181 This optical packaging engineer position is expected to participate the ... Engineering or Material Science - Minimum 5 years of experience with fiber optics packaging and fiber connector technology - Minimum 5 years of experience with die... more
Senior Software Engineer Intel Phoenix, AZ May 13
Software Engineer - 710701 Description Job Description: Software Engineers conduct or participate in multidisciplinary research and collaborate with design, layout and/or ... We will accept applications/resumes until 60 days after posting date or earlier at Intel s discretion. Intel invites people of all ages currently enrolled in an... more
System/Packaging CAD Engineer Intel Hillsboro, OR May 20
Title: System/Packaging CAD Engineer Location: USA-Oregon, Hillsboro Job Number: 707723 In this position, you will be joining the IDGa SOC design team to work on next gen ... state-of-the-art package and/or PCB design rules, automated test, and emerging IC packaging techniques - Test chip package design, tapeout and interface with vendors... more
Senior Package and Systems Architect Intel Santa Clara, CA May 06
Santa Clara Other Locations: USA-Field Sales Job Number: 710874 Come join Intel's premier research group! Intel Labs invent and validate new technologies, new ... - High speed package & substrate fabrication; including experience with PCB or packaging substrate manufacturers in a production environment - Optical product... more
Software Configuration Management Engineer Intel Philadelphia, PA May 20
Software Configuration Management Engineer - 710795 Description The Intel Fabric Software development team is looking for a software configuration management engineer to ... Posting Statement: We will accept applications/resumes until 60 days after posting date or earlier at Intel's discretion... more
Senior Packaging Engineer Intel Hillsboro, OR Apr 29
Title: Senior Packaging Engineer Location: USA-Oregon, Hillsboro Job Number: 707724 In this position, you will be joining the IDGa SOC design team to work on signal and power integrity for SOC products for phones and tablets. You will be accountable for the package's path-finding, definition, development, and PRQ. Responsibilities... more
Hybrid Virtual Platform Engineer Intel Phoenix, AZ May 06
Hybrid Virtual Platform Engineer - 703861 Description As part of the Virtual Platform Center of Expertise, you will be critical to the future success of Intel's SoC ... Posting Statement: We will accept applications/resumes until 60 days after posting date or earlier at Intel's discretion... more
Sr. Packaging Engineer Intel Phoenix, AZ Apr 26
Packaging Engineer Location: USA-Arizona, Phoenix Job Number: 710157 Job Description: Microelectronic Packaging Engineers provide project management, package design/devel ... regarding material quality and vendor performance. Provides consultation concerning packaging problems and improvements in the packaging process. Responds to... more
Packaging Engineer-Mechanical Intel Hillsboro, OR Apr 01
Packaging Engineer-Mechanical Location: USA-Oregon, Hillsboro Job Number: 706435 Intel Corporation Job Description: Emphasis in working with the design standards, ... Assurance and Purchasing groups regarding materials. Provide consultation concerning packaging problems and improvements in the packaging process. Qualifications: Masters... more
Packaging Engineer-Electrical Intel Phoenix, AZ Apr 01
Title: Packaging Engineer-Electrical Location: USA-Arizona, Phoenix Job Number: 705988 Intel Corporation Job Description: Emphasis in the electrical design and ... Assurance and Purchasing groups regarding materials. Provide consultation concerning packaging problems and improvements in the packaging process. Location: Chandler... more
Packaging process engineering Intern Intel Santa Clara, CA Mar 26
Title: Packaging process engineering Intern Location: USA-California, Santa Clara Job Number:_702049 The graduate packaging process engineering Intern are expected to ... Candidate with 1 years of educational or work experience with microelectronic packaging or optoelectronic packaging. Preferred skills and experience: Experience in... more
Senior Package Engineer Intel Phoenix, AZ Mar 26
mechanical analysis and structural integrity risk assessments of semiconductor packaging and assembly technologies influencing the architecture/design, materials ... Knowledge of commercial finite element and computational software; IC Packaging & PCB technologies; Composite/layered structures; and experimental methods a definite plus... more
Packaging Engineer Intel Phoenix, AZ Mar 26
Title: Packaging Engineer Location: USA-Arizona, Phoenix Job Number: 704857 Job Description: Microelectronic Packaging Engineers provide project management, package ... regarding material quality and vendor performance. Provides consultation concerning packaging problems and improvements in the packaging process. Responds to... more
Package Quality and Reliability Engineer Intern Intel Phoenix, AZ Mar 26
Title: Package Quality and Reliability Engineer Intern Location: USA-Arizona, Phoenix Job Number:_701117 A Package Quality and Reliability Engineer evaluates, from ... Chemistry, Physics, and Industrial Engineering. Preferred Qualifications: - Prior Intel internship or an Intel scholarship recipient - Have the unrestricted right to... more
Senior Packaging Assembly Engineer Intel Santa Clara, CA Mar 26
Title: Senior Packaging Assembly Engineer Location: USA-California, Santa Clara Job Number:_700935 Senior Packaging Engineers provide project management, package design/d ... material quality and vendor performance - Providing consultation concerning packaging problems and improvements in the packaging process - Responding to... more
DETD Packaging TD Engr - TF Dep Intel Phoenix, AZ May 11
Title: DETD Packaging TD Engr - TF Dep Location: USA-Arizona, Phoenix Job Number: 711387 The successful candidate would be expected to develop equipment and process ... She/he will need to interact with equipment and HDI substrate suppliers to enable technologies to meet Intel's long term roadmap and industry-leading vision... more
Optical Packaging assembly Eng Intel Santa Clara, CA May 04
Title: Optical Packaging assembly Eng Location: USA-California, Santa Clara Job Number:_632181 Optical packaging engineer is expected to participate the definition of ... engineering or material science-Minimum of 5 yrs. of experience on fiber optics packaging. - Minimum 5 yrs. of experience of die attachment, wire bond, micro optics... more
Package Design Lead Intel Folsom, CA Mar 29
Hillsboro, USA-Arizona, Phoenix Job Number: 708316 Job Description: Microelectronic Packaging Engineers provide project management, package design/development and ... regarding material quality and vendor performance. Provides consultation concerning packaging problems and improvements in the packaging process. Responds to... more
Board Assembly TD Process Engineer Intel Hillsboro, OR May 19
Assembly TD Process Engineer Location: USA-Oregon, Hillsboro Job Number: 710751 Intel's assembly technology development team is looking for engineers to help develop ... The role entails process and equipment development to 1) certify Intel next gen packaging solutions and 2) assemble prototypes of next generation Intel products. more
Senior Power Delivery Engineer Intel Hillsboro, OR May 20
Senior Power Delivery Engineer Location: USA-Oregon, Hillsboro Job Number: 706268 Intel Architecture Development Group (IDGa) needs high energy engineers to help drive ... fits the form factors being designed. This is an opportunity for a motivated senior engineer to be able to: * Participate in research of advanced power delivery methods... more
Lead System Engineer Intel Hillsboro, OR May 17
The Lead System Engineer must ensure that platform-level integration issues are addressed in a timely manner, so as to not impact the PLQ/Launch schedule, or impact OEM/O ... -Strong verbal and written communication skills -Ability to network easily among Intel's management and engineering leaders Job Category: Engineering Full/Part Time: Full... more
Product Development Engineer - Test Hardware Dev. Intel Massachusetts May 17
Title: Product Development Engineer - Test Hardware Dev. Location: USA-Massachusetts Job Number: 711689 Responsibilities: As a member of our team, you will be working in the Product Development Engineering (PDE) team within Server Development and Manufacturing Group focused on development and introduction of new generations of Xeon and... more